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Via Technologies Incorporation CEO Wenchi Chen has showcased the “world’s first industry-standard form-factor for PC/phone convergence” in the form of a 3 x 1.8inches “mobile-ITX” motherboard in the Computerex Trade Show in Taipei. Via suggests that it may be used as the basis for smartphones that are compatible with x86 architectures.

The mobile-ITX board was based on a 1GHz C7-S processor in a 9 x 11mm package with 256MB or 512MB RAM soldered on-board, and a CDMA baseband processor chip. It is capable of running Linux and Windows XP embedded but not Vista embedded, Via admits.

The development of the mobile-ITX board was the company’s promise for “ultra-mobility” where we see the platform shrinking further, with ever richer functionality. It gives us a glimpse of the future of ultra mobile devices and the real convergence of computing and communications.