IBM Develops Chip-Stacking Technique

[mini_0]

Some good news this is -
IBM said on Wednesday it will be able to make microchips faster and more energy efficient by stacking components on top of each other, a breakthrough that cuts the distance an electrical signal needs to travel.The technique works by drilling tiny holes through a wafer of silicon and filling them with metal. Components such as memory can then be stacked on top of the main part of the chip, eliminating the need for wires stretching out to the sides.

[x-man]

Sounds like a "piggy backing" technique! That's a clever idea actually. Propagation delay is the no. 1 concern in microchip design. Stacking chips together definitely cuts propagation delay. In layman's term, less wire the better. But yet, a better and an emerging technology is nanotechnology. Researches are ongoing in this exciting field and we expect its impact in 10 years time!

[mini_0]

I do think that any new innovation that does help in some way or the other and is advatageous without really hampering anything and serves a full purpose is welcome . The only thing that remains to be seen is how sucessful can this one be . IBM will use the method to make power management chips for wireless devices later this year, allowing them to use 40 per cent less power than previous versions . and i think being power efficient is also a great idea seeing the world wide power crisis .